- Part Status :
- Package / Case :
- Supplier Device Package :
- Core Processor :
- Speed :
- RAM Size :
- Data Converters :
6 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
1,180
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC3100 | Obsolete | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 270MHz | 1.1 V ~ 3.6 V | 20 | 192K x 8 | 16/32-Bit | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | ROMless | A/D 4x10b | External | ||
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GET PRICE |
2,343
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208TFBGA | LPC3100 | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-TFBGA | 208-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM9® | 180MHz | 1.1 V ~ 3.6 V | 10 | 192K x 8 | 16/32-Bit | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | ROMless | A/D 3x10b | External | ||
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GET PRICE |
1,614
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 208TFBGA | LPC3100 | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-TFBGA | 208-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM9® | 180MHz | 1.1 V ~ 3.6 V | 10 | 192K x 8 | 16/32-Bit | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | ROMless | A/D 3x10b | External | ||
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751
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC3100 | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 270MHz | 1.1 V ~ 3.6 V | 20 | 192K x 8 | 16/32-Bit | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG | ROMless | A/D 4x10b | External | |||
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2,549
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC3100 | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 180MHz | 1.1 V ~ 3.6 V | - | 96K x 8 | 16/32-Bit | EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG | ROMless | A/D 4x10b | External | |||
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3,489
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC3100 | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | DMA, I²S, LCD, PWM, WDT | ARM926EJ-S | 180MHz | 1.1 V ~ 3.6 V | - | 192K x 8 | 16/32-Bit | EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG | ROMless | A/D 4x10b | External |
