- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Peripherals :
- Voltage - Supply (Vcc/Vdd) :
- RAM Size :
- Core Size :
- Program Memory Size :
- Program Memory Type :
11 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2,204
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 144LQFP | HC16 | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, WDT | CPU16 | 16MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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2,513
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 144LQFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, WDT | CPU16 | 16MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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2,121
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 144LQFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, WDT | CPU16 | 25MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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944
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 144LQFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, WDT | CPU16 | 20MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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801
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 144LQFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, WDT | CPU16 | 16MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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1,663
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 132QFP | HC16 | Not For New Designs | Tray | -40°C ~ 105°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | POR, PWM, WDT | CPU16 | 16MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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1,688
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 132QFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | POR, PWM, WDT | CPU16 | 25MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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2,044
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 132QFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | POR, PWM, WDT | CPU16 | 20MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal | |||
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1,171
In-stock
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NXP USA Inc. | IC MCU 16BIT 16KB FLASH 52LQFP | HCS12 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 35 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | 16KB (16K x 8) | Flash | A/D 8x10b | Internal | |||
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3,867
In-stock
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NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144LQFP | MCore | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | LVD, POR, PWM, WDT | M210 | 33MHz | 2.7 V ~ 3.6 V | 67 | 32K x 8 | 32-Bit | EBI/EMI, SCI, SPI | 256KB (256K x 8) | Flash | A/D 8x10b | Internal | |||
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2,055
In-stock
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NXP USA Inc. | IC MCU 16BIT ROMLESS 132QFP | HC16 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | POR, PWM, WDT | CPU16 | 16MHz | 2.7 V ~ 5.5 V | 16 | 1K x 8 | 16-Bit | EBI/EMI, SCI, SPI | - | ROMless | A/D 8x10b | Internal |
