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15 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,908
In-stock
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Texas Instruments | IC MCU 32BIT 512KB FLASH 176HQFP | C2000™ C28x Piccolo™ | Obsolete | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | DMA, POR, PWM, WDT | C28x | 120MHz | 1.14 V ~ 3.47 V | 97 | 50K x 16 | 32-Bit | CAN, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART, USB | 512KB (256K x 16) | Flash | - | A/D 17x12b, D/A 3x12b | External | ||
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1,365
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,163
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,784
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,975
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,470
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,943
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,698
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,568
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,886
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,037
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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875
In-stock
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,169
In-stock
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Texas Instruments | IC MCU 32BIT 512KB FLASH 176HQFP | C2000™ C28x Piccolo™ | Active | Tray | -40°C ~ 125°C (TJ) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | DMA, POR, PWM, WDT | C28x | 120MHz | 1.14 V ~ 3.47 V | 97 | 50K x 16 | 32-Bit | CAN, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART, USB | 512KB (256K x 16) | Flash | - | A/D 17x12b, D/A 3x12b | External | |||
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3,150
In-stock
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Texas Instruments | IC MCU 32BIT 512KB FLASH 176HQFP | Automotive, AEC-Q100, C2000™ C28x Piccolo™ | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | DMA, POR, PWM, WDT | C28x | 120MHz | 1.14 V ~ 3.47 V | 97 | 50K x 16 | 32-Bit | CAN, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART, USB | 512KB (256K x 16) | Flash | - | A/D 17x12b, D/A 3x12b | External | |||
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1,266
In-stock
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Texas Instruments | IC MCU 32BIT 512KB FLASH 176HQFP | C2000™ C28x Piccolo™ | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | DMA, POR, PWM, WDT | C28x | 120MHz | 1.14 V ~ 3.47 V | 97 | 50K x 16 | 32-Bit | CAN, EBI/EMI, I²C, McBSP, SCI, SPI, UART/USART, USB | 512KB (256K x 16) | Flash | - | A/D 17x12b, D/A 3x12b | External |
