- Package / Case :
- Supplier Device Package :
2 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Primary Attributes | Core Processor | Speed | Architecture | Flash Size | RAM Size | Connectivity | |
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3,471
In-stock
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Microsemi Corporation | IC FPGA SOC | Automotive, AEC-Q100, SmartFusion®2 | Active | Tray | -40°C ~ 125°C (TJ) | 676-BGA | 676-FBGA (27x27) | DDR, PCIe, SERDES | FPGA - 90K Logic Modules | ARM® Cortex®-M3 | 166MHz | MCU, FPGA | 512kb | 64kb | CAN, Ethernet, I²C, SPI, UART/USART, USB | ||||
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1,712
In-stock
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Microsemi Corporation | IC FPGA SOC | Automotive, AEC-Q100, SmartFusion®2 | Active | Tray | -40°C ~ 125°C (TJ) | 484-BGA | 484-FPBGA (23x23) | DDR, PCIe, SERDES | FPGA - 90K Logic Modules | ARM® Cortex®-M3 | 166MHz | MCU, FPGA | 512kb | 64kb | CAN, Ethernet, I²C, SPI, UART/USART, USB |