- Package / Case :
- Supplier Device Package :
3 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Primary Attributes | Core Processor | Speed | Architecture | Flash Size | RAM Size | Connectivity | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
3,006
In-stock
|
Microsemi Corporation | IC FPGA SOC | Automotive, AEC-Q100, SmartFusion®2 | Active | Tray | -40°C ~ 125°C (TJ) | 484-BGA | 484-FPBGA (23x23) | DDR, PCIe, SERDES | FPGA - 10K Logic Modules | ARM® Cortex®-M3 | 166MHz | MCU, FPGA | 256Kb | 64kb | CAN, Ethernet, I²C, SPI, UART/USART, USB | ||||
|
3,147
In-stock
|
Microsemi Corporation | IC FPGA SOC | Automotive, AEC-Q100, SmartFusion®2 | Active | Tray | -40°C ~ 125°C (TJ) | 400-LFBGA | 400-VFBGA (17x17) | DDR, PCIe, SERDES | FPGA - 10K Logic Modules | ARM® Cortex®-M3 | 166MHz | MCU, FPGA | 256Kb | 64kb | CAN, Ethernet, I²C, SPI, UART/USART, USB | ||||
|
705
In-stock
|
Microsemi Corporation | IC FPGA SOC | Automotive, AEC-Q100, SmartFusion®2 | Active | Tray | -40°C ~ 125°C (TJ) | 256-LBGA | 256-FPBGA (17x17) | DDR, PCIe, SERDES | FPGA - 10K Logic Modules | ARM® Cortex®-M3 | 166MHz | MCU, FPGA | 256Kb | 64kb | CAN, Ethernet, I²C, SPI, UART/USART, USB |