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5 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Color | Packaging | Size / Dimension | Type | Height | Configuration | Current - Max | Current - Test | Voltage - Forward (Vf) (Typ) | Wavelength | Viewing Angle | CCT (K) | Flux @ Current/Temperature - Test | Temperature - Test | Lumens/Watt @ Current - Test | Light Emitting Surface (LES) | Lens Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,110
In-stock
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Samsung Semiconductor, Inc. | HIGH POWER LED SERIES CHIP ON BO | COB D Gen2 | Active | White, Warm | Tray | 19.00mm L x 19.00mm W | Chip On Board (COB) | 1.50mm | Square | 1.15A | 450mA | 34.6V | - | 115° | 3300K | 1823 lm (Typ) | 85°C | 105 lm/W | 14.50mm Diameter | Flat | |||
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3,526
In-stock
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Samsung Semiconductor, Inc. | HIGH POWER LED SERIES CHIP ON BO | COB D Gen2 | Active | White, Warm | Tray | 13.50mm L x 13.50mm W | Chip On Board (COB) | 1.50mm | Square | 920mA | 360mA | 34.6V | - | 115° | 3300K | 1394 lm (Typ) | 85°C | 112 lm/W | 9.80mm Diameter | Flat | |||
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2,665
In-stock
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Samsung Semiconductor, Inc. | HIGH POWER LED SERIES CHIP ON BO | COB D Gen2 | Active | White, Warm | Tray | 19.00mm L x 19.00mm W | Chip On Board (COB) | 1.50mm | Square | 1.84A | 720mA | 34.6V | - | 115° | 3300K | 2827 lm (Typ) | 85°C | 113 lm/W | 14.50mm Diameter | Flat | |||
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3,971
In-stock
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Samsung Semiconductor, Inc. | HIGH POWER LED SERIES CHIP ON BO | COB D Gen2 | Active | White, Warm | Tray | 19.00mm L x 19.00mm W | Chip On Board (COB) | 1.50mm | Square | 1.38A | 540mA | 34.6V | - | 115° | 3300K | 2160 lm (Typ) | 85°C | 116 lm/W | 14.50mm Diameter | Flat | |||
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3,442
In-stock
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Samsung Semiconductor, Inc. | HIGH POWER LED SERIES CHIP ON BO | COB D Gen2 | Active | White, Warm | Tray | 19.00mm L x 19.00mm W | Chip On Board (COB) | 1.50mm | Square | 2.3A | 900mA | 34.6V | - | 115° | 3300K | 3488 lm (Typ) | 85°C | 112 lm/W | 14.50mm Diameter | Flat |
