- Height :
- Attachment Method :
5 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,993
In-stock
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Laird Technologies EMI | DCON,25P,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.690" (17.53mm) | Tin | 299.21µin (7.60µm) | Slot | |||
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1,535
In-stock
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Laird Technologies EMI | DCON,25P,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.360" (9.14mm) | - | - | Slot | |||
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2,534
In-stock
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Laird Technologies EMI | DCON,25P,SS | - | Active | Stainless Steel | 121°C | Fingerstock | - | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.690" (17.53mm) | - | - | Slot | |||
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1,144
In-stock
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Laird Technologies EMI | GK NICU PTAFG PU V0 REC | - | Active | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | Fabric Over Foam | Rectangle | 0.039" (1.00mm) | 2.280" (57.91mm) | 0.118" (3.00mm) | - | - | Adhesive | |||
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2,429
In-stock
|
Laird Technologies EMI | DCON,25P,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.025" (0.64mm) | 2.280" (57.91mm) | 0.690" (17.53mm) | - | - | Slot |
