- Height :
- Plating :
- Attachment Method :
8 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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1,712
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
|
1,185
In-stock
|
Laird Technologies EMI | NOSG,STR,ZNC,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Slot | ||||
|
1,835
In-stock
|
Laird Technologies EMI | NOSG,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
753
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,287
In-stock
|
Laird Technologies EMI | NOSG,STR,BF,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | - | - | Slot | ||||
|
3,284
In-stock
|
Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.152" (3.86mm) | 16.200" (411.48mm) | 0.600" (15.24mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
1,168
In-stock
|
Laird Technologies EMI | GASKET BECU 11.43X411.48MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
|
3,517
In-stock
|
Laird Technologies EMI | GASKET BECU 11.43X411.48MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.122" (3.10mm) | 16.200" (411.48mm) | 0.450" (11.43mm) | - | - | Adhesive |