- Manufacture :
- Operating Temperature :
- Shape :
- Plating - Thickness :
- Attachment Method :
37 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2,272
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 CDC 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Cadmium + Clear Chromate | Flash | Adhesive | |||
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1,527
In-stock
|
Leader Tech Inc. | 0.13 X 0.281 MAG 16--13-28U-MAG- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Silver | Flash | Adhesive | |||
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2,830
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--11-28RH-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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3,932
In-stock
|
Leader Tech Inc. | EMI FABRIC GASKET 1.52X7.11MM | - | Active | Polyurethane Foam, Nickel-Copper Ripstop (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.060" (1.52mm) | 23.62" (599.95mm) | 0.280" (7.11mm) | - | - | Non-Conductive Adhesive | |||
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1,143
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
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2,302
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 7.11X406.4MM | - | Active | - | - | - | - | - | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | - | |||
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3,810
In-stock
|
Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
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871
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 NI 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
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3,420
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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1,348
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
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3,517
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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2,921
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 SN 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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2,621
In-stock
|
Laird Technologies EMI | AP,STR,SU,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
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3,993
In-stock
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Leader Tech Inc. | 0.11 X 0.28 X 0.23 SN 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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3,857
In-stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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3,609
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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3,324
In-stock
|
Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
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2,928
In-stock
|
Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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3,451
In-stock
|
Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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3,297
In-stock
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Laird Technologies EMI | AP,STR,ZNY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | |||
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1,055
In-stock
|
Laird Technologies EMI | AP,STR,ZNC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | |||
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3,991
In-stock
|
Laird Technologies EMI | AP,STR,NID,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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3,640
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 BD 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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2,671
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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1,875
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.23 BD 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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715
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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2,850
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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3,805
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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1,597
In-stock
|
Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
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1,734
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16 NTP--FOLDED SE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive |
