- Height :
- Attachment Method :
5 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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673
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 6.6X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | - | - | Snap-In | ||||
|
3,878
In-stock
|
Laird Technologies EMI | GASKET BECU 6.6X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | - | - | Adhesive | ||||
|
3,036
In-stock
|
Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,924
In-stock
|
Laird Technologies EMI | AP,STR,SNSAT,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,607
In-stock
|
Laird Technologies EMI | FLX,STR,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Snap-In |