- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
106 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2,272
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 CDC 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Cadmium + Clear Chromate | Flash | Adhesive | ||||
|
1,085
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 BD 16--11-32RH-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | ||||
|
3,395
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 BD 16--11-32AF-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | ||||
|
2,830
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--11-28RH-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
|
1,980
In-stock
|
Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
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2,368
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.1X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
3,734
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.1X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Slot | ||||
|
2,496
In-stock
|
Leader Tech Inc. | 0.14 X 0.90 BD 16--11-89RA-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.890" (22.61mm) | Unplated | - | Adhesive | ||||
|
1,008
In-stock
|
Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Adhesive | ||||
|
2,612
In-stock
|
Leader Tech Inc. | 0.11 X 0.44 X 070 BD 16--11-45C- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
|
3,136
In-stock
|
Leader Tech Inc. | 0.11 X 0.44 X 050 BD 16--11-45C- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
|
1,952
In-stock
|
Leader Tech Inc. | 0.11 X 0.44 X 045 BD 16--11-45C- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
|
3,268
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 NI 16--11-32AH-NI-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | ||||
|
1,143
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
1,830
In-stock
|
Leader Tech Inc. | 0.11 X 0.375 SN 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
3,253
In-stock
|
Leader Tech Inc. | 0.11 X 0.375 NI 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | Flash | Adhesive | ||||
|
1,035
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.1X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Slot | ||||
|
1,093
In-stock
|
Laird Technologies EMI | GASKET BECU ALLOY 8.1X406.4MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Slot | ||||
|
871
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 NI 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
3,420
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
1,613
In-stock
|
Leader Tech Inc. | 0.11 X 0.45 CT BD 16--11-45CT-BD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
|
3,938
In-stock
|
Leader Tech Inc. | 0.11 X 0.45 CD BD 16--11-45CD-BD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
|
1,348
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
1,023
In-stock
|
Leader Tech Inc. | 0.11 X 0.375 SN 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | Flash | Adhesive | ||||
|
3,785
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 SN 16--11-32AH-SN-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
|
3,517
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
3,872
In-stock
|
Leader Tech Inc. | 0.12 X 0.90 BD 16--11-90S-BD-16- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.900" (22.86mm) | Unplated | - | Adhesive | ||||
|
2,921
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 SN 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
3,878
In-stock
|
Laird Technologies EMI | GASKET BECU 6.6X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | - | - | Adhesive | ||||
|
2,621
In-stock
|
Laird Technologies EMI | AP,STR,SU,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive |