- Manufacture :
- Series :
- Operating Temperature :
- Length :
-
- 0.169" (4.29mm) (3)
- 0.356" (9.04mm) (4)
- 0.540" (13.72mm) (1)
- 0.543" (13.79mm) (3)
- 0.730" (18.54mm) (3)
- 0.917" (23.29mm) (1)
- 1.291" (32.79mm) (1)
- 1.665" (42.29mm) (1)
- 14.010" (355.85mm) (1)
- 15.000" (381.00mm) (6)
- 16.000" (406.40mm) (29)
- 17.760" (451.10mm) (1)
- 6.900" (175.26mm) (1)
- 7.640" (194.06mm) (1)
- Plating - Thickness :
- Attachment Method :
56 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1,285
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 SN 0.73--11-32RH-SN- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
|
2,368
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.1X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
1,663
In-stock
|
Laird Technologies EMI | S3,STR,SNSAT,USFT,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,302
In-stock
|
Leader Tech Inc. | 0.11 X 0.35 SN 15 NTP--11-35DT-S | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | Flash | Adhesive | ||||
|
1,830
In-stock
|
Leader Tech Inc. | 0.11 X 0.375 SN 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
|
2,121
In-stock
|
Leader Tech Inc. | 0.11 X 0.354 SN 15--11-S-35DTS-S | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | Flash | Adhesive | ||||
|
3,420
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
1,023
In-stock
|
Leader Tech Inc. | 0.11 X 0.375 SN 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | Flash | Adhesive | ||||
|
878
In-stock
|
Leader Tech Inc. | 0.11 X 0.35 SN 15--11-35DT-SN-15 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | Flash | Adhesive | ||||
|
3,785
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 SN 16--11-32AH-SN-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
|
3,517
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
2,921
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 SN 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
3,993
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.23 SN 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||||
|
3,036
In-stock
|
Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,924
In-stock
|
Laird Technologies EMI | AP,STR,SNSAT,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
1,297
In-stock
|
Laird Technologies EMI | GASKET BECU 8.1MMX7.6M | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
3,129
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 SN 0.54--11-32RH-SN- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.540" (13.72mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
|
3,810
In-stock
|
Laird Technologies EMI | SLMT,4F,SNB,USFT | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
2,060
In-stock
|
Laird Technologies EMI | SLMT,4F,SNB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
2,180
In-stock
|
Laird Technologies EMI | SLMT,3F,SNB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.543" (13.79mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
1,335
In-stock
|
Laird Technologies EMI | SLMT,2F,SNB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
2,959
In-stock
|
Laird Technologies EMI | SLMT,1F,SNB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
1,757
In-stock
|
Laird Technologies EMI | FINGERSTOCK BECU 8.1X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
|
2,850
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
2,092
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 SN 16--11-32RH-SN-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
|
1,171
In-stock
|
Laird Technologies EMI | S3,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,202
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 SN 14.01--11-S-32AF- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 14.010" (355.85mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | ||||
|
2,576
In-stock
|
Leader Tech Inc. | 0.10 X 0.26 SN 16--10-26UD-SN-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | Flash | Adhesive | ||||
|
2,586
In-stock
|
Leader Tech Inc. | 0.11 X 0.44 X 070 SN 16--11-45C- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | ||||
|
2,308
In-stock
|
Leader Tech Inc. | 0.14 X 0.90 SN 16--11-89RA-SN-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.890" (22.61mm) | Tin | Flash | Adhesive |