- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
36 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1,383
In-stock
|
Leader Tech Inc. | 0.11 X 0.35 NI 15 NTP--11-35-DTS | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | Flash | Adhesive | ||||
|
876
In-stock
|
Leader Tech Inc. | 0.11 X 0.35 NI 15 NTP--11-35DTS- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | Flash | Adhesive | ||||
|
846
In-stock
|
Laird Technologies EMI | NOSG, STR,NIB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
1,321
In-stock
|
Laird Technologies EMI | NOSG,STR,NID,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
2,805
In-stock
|
Leader Tech Inc. | 0.11 X 0.35 NI 0.358 NTP--11-35D | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 0.358" (9.09mm) | 0.350" (8.89mm) | Nickel | Flash | Adhesive | ||||
|
1,444
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 NI 0.17--11-S-32RH-N | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 0.170" (4.32mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | ||||
|
3,268
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 NI 16--11-32AH-NI-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | ||||
|
1,143
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
3,253
In-stock
|
Leader Tech Inc. | 0.11 X 0.375 NI 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | Flash | Adhesive | ||||
|
3,799
In-stock
|
Leader Tech Inc. | 0.11 X 0.35 NI 15--11-35DT-NI-15 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | Flash | Adhesive | ||||
|
2,525
In-stock
|
Laird Technologies EMI | S3,STR,NIB,RIV | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | 299.21µin (7.60µm) | Rivet | ||||
|
871
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 NI 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
1,348
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
2,928
In-stock
|
Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
3,451
In-stock
|
Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
3,991
In-stock
|
Laird Technologies EMI | AP,STR,NID,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
1,589
In-stock
|
Laird Technologies EMI | SLMT,3F,NIB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 0.543" (13.79mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
|
3,536
In-stock
|
Laird Technologies EMI | SLMT,2F,NIB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
|
948
In-stock
|
Laird Technologies EMI | SLMT,2F,NIE | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
|
715
In-stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
1,734
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16 NTP--FOLDED SE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
3,158
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 NI 16--11-32RH-NI-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | ||||
|
2,873
In-stock
|
Leader Tech Inc. | 0.11 X 0.32 NI 16--11-32AF-NI-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | ||||
|
1,534
In-stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.23 NI 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
|
3,787
In-stock
|
Laird Technologies EMI | S3,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
2,497
In-stock
|
Laird Technologies EMI | S3,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
1,158
In-stock
|
Leader Tech Inc. | 0.10 X 0.26 NI 16--10-26UD-NI-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Nickel | Flash | Adhesive | ||||
|
1,054
In-stock
|
Laird Technologies EMI | VSLMT,STR,NIB,USFT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
|
1,816
In-stock
|
Laird Technologies EMI | SLMT,STR,NIB,USFT | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
|
2,621
In-stock
|
Laird Technologies EMI | SLMT,STR,NIB | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | 299.21µin (7.60µm) | Slot |